Methods of manufacturing vertical channel semiconductor devices

ABSTRACT

Vertical channel semiconductor devices include a semiconductor substrate with a pillar having an upper surface. An insulated gate electrode is around a periphery of the pillar. The insulated gate electrode has an upper surface at a vertical level lower than the upper surface of the pillar to vertically space apart the insulated gate electrode from the upper surface of the pillar. A first source/drain region is in the substrate adjacent the pillar. A second source/drain region is disposed in an upper region of the pillar including the upper surface of the pillar. A contact pad contacts the entire upper surface of the pillar to electrically connect to the second source/drain region.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional application of U.S. application Ser.No. 12/022,329 filed Jan. 30, 2008 which is continuation application ofU.S. application Ser. No. 11/448,437, which was filed Jun. 7, 2006 andissued as U.S. Pat. No. 7,348,628 on Mar. 25, 2008, and claims priorityto Korean Patent Application No. 10-2005-0064182, filed on Jul. 15,2005, in the Korean Intellectual Property Office, the disclosure ofwhich is incorporated herein by reference in its entirety.

BACKGROUND OF THE INVENTION

The present invention relates to semiconductor devices and methods ofmanufacturing the same, and more particularly, to vertical channelsemiconductor devices and methods of manufacturing the same.

As the integration density of semiconductor devices increases, the sizeof features, such as metal oxide semiconductor (MOS) transistors (i.e.,the channel length of a MOS transistor) decreases so that more devicesmay be integrated on a substrate in a given area. However, when thechannel length of the MOS transistor decreases, short channel effects(e.g., a drain induced barred barrier lowering (DIBL) effect, a hotcarrier effect and/or a punch trough effect) may also be caused, whichmay affect performance of the high integration density semiconductordevice. Various methods have been proposed to address short channeleffects. One method is to reduce the depth of a junction region andanother method is to form a groove in a channel region to relativelyextend the channel length.

However, in the case of a semiconductor memory device, such as a dynamicrandom access memory (DRAM), a MOS transistor with a channel length ofbelow an exposure limit is generally required as the integration densityapproaches a gigabit level. Therefore, a planar type MOS transistor, inwhich a source and a drain are formed on substantially the same plane,is difficult to implement in a gigabit memory device.

Vertical channel semiconductor devices have been proposed in which asource and a drain are vertically arranged to form a vertical channel.FIG. 1 is a cross-sectional view of a conventional vertical channelsemiconductor device. As shown in FIG. 1, the vertical channelsemiconductor device includes pillars 15 that may be defined in asemiconductor substrate 10 by a hard mask pattern. A gate electrode 25is shown formed on the surface of the pillar 15 that surrounds theperiphery of the pillar 15. A gate insulation layer 20 is interposedbetween the gate electrode 25 and the pillar 15. A drain region 30 a isformed in the substrate 10 between the pillars 15, and a source region30 b is formed on the upper surface of the pillar 15 between (surroundedby) the gate electrodes 25. A bit line 35 is selectively formed on thesurface of the drain region 30 a. An interlayer insulating layer 40 isformed between the pillars 15 so as to insulate the pillars 15 from eachother, and a contact pad 45 is formed to contact with the source region30 b. An insulating layer 50 is formed between the source contact pad 45and the interlayer insulating layer 40 so as to insulate the sourcecontact pad 45 and the interlayer insulating layer 40 from each other.

A channel between the source region 30 b and the drain region 30 b isformed with a substantially vertical type architecture as the sourceregion 30 b is formed in the upper region of the pillar 115 and thedrain region 30 a is formed in the lower region of the pillar 15.Therefore, the channel length may not be affected by a decrease in theplanar surface area of the MOS transistor.

Thus, while the planar area required for a MOS transistor may bedecreased with a vertical architecture, the channel length may not beaffected as the planar area of the vertical channel semiconductordevice, including the areas of the pillar 15 and the source region 30 b,decrease. However, the area of the contact pad 45 contacting with thesource region 30 b decreases, which may increase the contact resistance.As the insulating spacer 50 is formed over the pillar 15 to insulate thecontact pad 45 from the gate electrode 25, the area of the contact pad45 further decreases due to the area occupied by the insulating spacer50, which may even further increase the contact resistance to the sourceregion 30 b. This structure may also increase the contact resistance ofa storage electrode that will contact with the contact pad 45.

Moreover, the bit line 35 is typically formed by exposing apredetermined portion of the drain region 30 a and selectively forming aconductive layer in the exposed drain region 30 a. As such, the exposeddrain region 30 a is also narrowed with increasingly high integrationdensity of the semiconductor device and the contact area between thedrain region 30 a and the bit line 35 is also narrowed, which may makeit difficult to obtain a low contact resistance between the drain region30 a and the bit line 35.

SUMMARY OF THE INVENTION

Some embodiments of the present invention provide vertical channelsemiconductor devices. A semiconductor substrate includes a pillarhaving an upper surface. An insulated gate electrode is around aperiphery of the pillar. The insulated gate electrode has an uppersurface at a vertical level lower than the upper surface of the pillarto vertically space apart the insulated gate electrode from the uppersurface of the pillar. A first source/drain region is in the substrateadjacent the pillar. A second source/drain region is disposed in anupper region of the pillar including the upper surface of the pillar. Acontact pad contacts the entire upper surface of the pillar toelectrically connect to the second source/drain region.

In other embodiments, the pillar includes an isotropic space disposed ata position vertically spaced apart from the upper surface of the pillarby a predetermined distance to define the vertical level of the uppersurface of the gate electrode. The gate electrode fills the isotropicspace. The device further includes a gate insulating layer interposedbetween the pillar and the gate electrode. The gate insulating layer mayextend vertically along a sidewall of the pillar between the uppersurface of the pillar and the isotropic space. The gate insulating layermay be a silicon oxide (SiO₂) layer, a hafnium oxide (HfO₂) layer, atantalum oxide (Ta₂O₅) layer, an oxide/nitride (ON) layer and/or anoxide/nitride/oxide (ONO) layer.

In further embodiments, a gate signal line contacts the gate electrode.A first source/drain signal line contacts the first source/drain regionand extends in a direction perpendicular to the gate signal line. Thefirst source/drain signal line may be insulated from the gate electrodeand surround a periphery of the gate electrode. The first source/drainregion may include an isotropic space vertically spaced apart from anupper surface of the source/drain region and the first source/drainsignal line may be in the isotropic space. An insulating layer may covera sidewall of the first source/drain region extending between the uppersurface of the first source/drain region and the first source/drainsignal line.

In other embodiments, the first source/drain region and the secondsource/drain region are electrically insulated from each other by thegate electrode and a gate insulating layer. An insulating spacer may beprovided around the periphery of the pillar and the insulated gateelectrode. A storage electrode may be disposed on the contact pad.

In yet further embodiments, vertical channel semiconductor devicesinclude a semiconductor substrate including a pillar. An insulated gateelectrode is around a periphery of the pillar. A first source/drainregion is around the periphery of the pillar below the gate electrode.The first source/drain region includes an isotropic space under the gateelectrode and vertically spaced from an upper surface of the firstsource/drain region. A second source/drain region is in an upper regionof the pillar. A first source/drain signal line is under the gateelectrode in the isotropic space of the first source/drain region andcontacts the first source/drain region. An insulating layer may cover asidewall of the first source/drain region extending between the uppersurface of the first source/drain region and the first source/drainsignal line.

In other embodiments, the pillar includes an isotropic space disposed ata position vertically spaced apart from the upper surface of the pillarby a predetermined distance and the gate electrode fills the isotropicspace. The device further includes a gate insulating layer interposedbetween the pillar and the gate electrode. The first source/drainregion, the second source/drain region and the gate electrode may beelectrically insulated from one other by a gate insulating layer. Thegate insulating layer may be a silicon oxide (SiO₂) layer, a hafniumoxide (HfO₂) layer, a tantalum oxide (Ta₂O₅) layer, an oxide/nitride(ON) layer and/or an oxide/nitride/oxide (ONO) layer. An insulatingspacer may be provided around the periphery of the pillar and theinsulated gate electrode. A contact pad may be on the secondsource/drain region and a storage electrode may be on the contact pad. Agate signal line may contact the gate electrode and the gate electrode,the gate signal line and/or the first source/drain signal line may beformed of a transition metal layer, a transition metal nitride layerand/or a transition metal silicide layer.

In yet other embodiments, vertical channel semiconductor devices includea semiconductor substrate including a pillar. An insulated gateelectrode is around a periphery of the pillar. A first source/drainregion is disposed on the semiconductor substrate below the gateelectrode and around the periphery of the gate electrode. A secondsource/drain region is in an upper region of the pillar. A firstsource/drain signal line is on the sidewall of the first source/drainregion that overlaps a portion of the gate electrode and is insulatedtherefrom. The first source/drain signal line has a tapered uppersurface in a region thereof overlapping the gate electrode.

In some embodiments of the present invention, methods of manufacturing avertical channel semiconductor device include forming a pillar on asemiconductor substrate having a vertical depth and an upper surfacedisplaced from the semiconductor substrate. An isotropic space is formedin the pillar at a predetermined position vertically spaced from theupper surface of the pillar. A gate insulating layer is formed on thepillar including the isotropic space. The isotropic space of the pillaris filled with a conductive material to form a gate electrode around thepillar at a position spaced apart from the upper surface of the pillarby a predetermined distance. A first source/drain region is formed onthe semiconductor substrate below the gate electrode and a secondsource/drain region is formed on the entire upper surface of the gateelectrode.

In other embodiments, forming the pillar includes forming a pad oxidelayer and a hard mask pattern on the semiconductor substrate and formingpillars by etching the pad oxide layer and the semiconductor substrateto a predetermined depth in the shape of the hard mask pattern. Formingthe second source/drain region is preceded by removing the hard maskpattern. Forming the pillar may include etching the semiconductorsubstrate to a first depth using the hard mask pattern as an etch mask,selectively forming an insulating layer on a sidewall of the etchedsemiconductor substrate and further etching the semiconductor substrateto a second depth using the hard mask pattern and the insulating layeras an etch mask. Forming the isotropic space may include etching theexposed sidewall of the pillar to a thickness of about 150-500 Å usingthe hard mask pattern and the insulating layer as an etch mask. Formingthe gate insulating layer may include thermally oxidizing a surface ofthe semiconductor substrate including the pillar.

In yet further embodiments, between forming the first source/drainregion and removing the hard mask pattern, a first source/drain signalline is formed contacting the first source/drain region and a gatesignal line is formed contacting the gate electrode. Forming the firstsource/drain signal line may include etching the first source/drainregion to a predetermined depth, forming an isotropic space in the firstsource/drain region at a position spaced apart from an upper surface ofthe first source/drain region by a predetermined distance, filling aconductive layer in the isotropic space in the first source/drain regionand etching the semiconductor substrate to a predetermined depth toseparate the first source/drain region from an adjacent source drainregion associated with another of the pillars. Forming the isotropicspace in the first source/drain region may include forming an insulatingspacer to fill a row directional gap between the pillars, etching thefirst source/drain region to a selected depth using the insulatingspacer as an etch mask, selectively forming an insulating layer on asidewall of the exposed first source/drain region, etching the drainregion to a further depth using the insulating spacer as an etch maskand isotropically etching the first source/drain region exposed with aportion of the sidewall thereof covered with the insulating layer.

In other embodiments, forming the first source/drain signal lineincludes etching the first source/drain region to a predetermined depth,forming a conductive spacer on a sidewall of the first source/drainregion to form the first source/drain signal line and etching, using theconductive spacer an etch mask, the semiconductor substrate to separatethe first source/drain region from an adjacent source drain regionassociated with another of the pillars. Forming the gate signal line mayinclude depositing a first interlayer insulating layer on thesemiconductor substrate including the first source/drain signal linethereon, etching a portion of the first interlayer insulating layer toform a line groove that is perpendicular to the first source/drainsignal line and exposes the gate electrode of the pillar, filling theline groove with a conductive layer contacting with the gate electrode,etching back the conductive layer to a predetermined thickness and thenfilling the line groove with a second interlayer insulating layer. Afterforming of the second source/drain region, conductive layer may be onthe second interlayer insulating layer to fill a space from which thehard mask pattern is removed and the conductive layer may be planarizedto form a contact pad. A storage electrode may be formed on the contactpad.

In yet further embodiments, method of manufacturing a vertical channelsemiconductor device include forming a pillar having a vertical depth ona semiconductor substrate and forming a gate electrode around aperiphery of the pillar. A first source/drain region is formed on thesemiconductor substrate below the gate electrode. The first source/drainregion is etched to a predetermined depth to expose a sidewall of thefirst source/drain region. An isotropic space is formed on the sidewallof the first source/drain region vertically spaced apart from an uppersurface of the first source/drain region by a predetermined distance.The isotropic space is filled with a conductive layer to form a firstsource/drain signal line. A second source/drain region is formed on anexposed upper surface of the pillar.

In other embodiments, forming the pillar includes forming a pad oxidelayer and a hard mask pattern on the semiconductor substrate, formingthe pillar by etching the pad oxide layer and the semiconductorsubstrate to a predetermined depth in the shape of the hard maskpattern. Forming the second source/drain region is preceded byseparating the first source/drain region from adjacent source/drainregions and removing the hard mask pattern. Forming the pillar mayinclude etching the semiconductor substrate to a first depth using thehard mask pattern as an etch mask, selectively forming an insulatinglayer on the sidewall of the etched semiconductor substrate and furtheretching the semiconductor substrate to a second depth using the hardmask pattern and the insulating layer as an etch mask. Forming the gateelectrode may include isotropically etching the pillar using the hardmask pattern and the insulating layer as an etch mask to form anisotropic space, forming a gate insulating layer on the surface of thepillar including the isotropic space and filling the isotropic spacewith a conductive layer.

In yet other embodiments, forming the gate electrode includesanisotropically etching the pillar to a predetermined width using thehard mask pattern as an etch mask and covering the periphery of thepillar with a conductive layer. The method may further include forming agate signal line contacting the gate electrode after forming the firstsource/drain signal line and before removing the hard mask pattern.Forming the gate signal line may include depositing a first interlayerinsulating layer on the semiconductor substrate including the firstsource/drain signal line, etching a predetermined portion of the firstinterlayer insulating layer to form a line groove that is perpendicularto the first source/drain signal line and exposes the gate electrode ofthe sidewall of the pillar, filling the line groove with an conductivelayer contacting the gate electrode, etching back the conductive layerto a predetermined thickness and then filling the line groove with asecond interlayer insulating layer.

In some embodiments, after forming the second source/drain region, aconductive layer is deposited on the second interlayer insulating layerto fill a space from which the hard mask pattern is removed. Theconductive layer is planarized to form a contact pad. A storageelectrode is formed on the contact pad.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages of the present inventionwill become more apparent by describing in detail exemplary embodimentsthereof with reference to the attached drawings in which:

FIG. 1 is a cross-sectional view of a conventional vertical channelsemiconductor device;

FIG. 2 is a plan view illustrating a photoresist pattern for defining ahard mask pattern formed on a hard mask layer according to someembodiments of the present invention;

FIGS. 3A through 3J are perspective views illustrating a method ofmanufacturing a vertical channel semiconductor device according to someembodiments of the present invention;

FIGS. 4A through 4J are cross-sectional views illustrating a method ofmanufacturing a vertical channel semiconductor device according to someembodiments of the present invention, with regions “X1”, “X2” and “Y” inFIGS. 4A through 4J being sections taken along lines X1-X1′, X2-X2′ andY-Y′ in FIG. 2, respectively;

FIGS. 5A through 5D are perspective views illustrating a method ofmanufacturing a vertical channel semiconductor device according tofurther embodiments of the present invention;

FIGS. 6A through 6D are cross-sectional views illustrating a method ofmanufacturing a vertical channel semiconductor device according tofurther embodiment of the present invention, with regions “X1”, “X2” and“Y” in FIGS. 6A through 6D being sections taken along lines X1-X1′,X2-X2′ and Y-Y′ in FIG. 2, respectively;

FIGS. 7A through 7D are perspective views illustrating a method ofmanufacturing a vertical channel semiconductor device according to otherembodiments of the present invention;

FIGS. 8A through 8D are cross-sectional views illustrating a method ofmanufacturing a vertical channel semiconductor device according to otherembodiments of the present invention, with regions “X1”, “X2” and “Y” inFIGS. 7A through 7D being sections taken along lines X1-X1′, X2-X2′ andY-Y′ in FIG. 2, respectively;

FIG. 9 is a perspective view of a vertical channel semiconductor deviceaccording to some embodiments of the present invention; and

FIG. 10 is a cross-sectional view of a vertical channel semiconductordevice according to some embodiment of the present invention, withregions “X1”, “X2” and “Y” in FIG. 10 being sections taken along linesX1-X1′, X2-X2′ and Y-Y′ in FIG. 2, respectively.

DETAILED DESCRIPTION OF THE INVENTION

The invention is described more fully hereinafter with reference to theaccompanying drawings, in which embodiments of the invention are shown.This invention may, however, be embodied in many different forms andshould not be construed as limited to the embodiments set forth herein.Rather, these embodiments are provided so that this disclosure will bethorough and complete, and will fully convey the scope of the inventionto those skilled in the art. In the drawings, the size and relativesizes of layers and regions may be exaggerated for clarity.

It will be understood that when an element or layer is referred to asbeing “on”, “connected to” or “coupled to” another element or layer, itcan be directly on, connected or coupled to the other element or layeror intervening elements or layers may be present. In contrast, when anelement is referred to as being “directly on,” “directly connected to”or “directly coupled to” another element or layer, there are nointervening elements or layers present. Like numbers refer to likeelements throughout. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings of the present invention.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Embodiments of the present invention are described herein with referenceto cross-section illustrations that are schematic illustrations ofidealized embodiments of the present invention. As such, variations fromthe shapes of the illustrations as a result, for example, ofmanufacturing techniques and/or tolerances, are to be expected. Thus,embodiments of the present invention should not be construed as limitedto the particular shapes of regions illustrated herein but are toinclude deviations in shapes that result, for example, frommanufacturing. For example, an etched region illustrated as a rectanglewill, typically, have rounded or curved features. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region of a device andare not intended to limit the scope of the present invention.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

In some embodiments of the present invention, a vertical channelsemiconductor device is formed to have a gate electrode that is formedspaced apart from the upper surface of pillar by a predetermineddistance so that a source region can be formed on the entire uppersurface of the pillar. The gate electrode is insulated from and spacedapart from the upper surface of the pillar by the predetermineddistance. Accordingly, the source can be formed on the entire area ofthe pillar and, thus, a contact pad can be formed to contact with theentire surface of the source. Consequently, it may be possible toimprove (or reduce) the source contact resistance in some embodiments ofthe present invention.

In some embodiments, the vertical channel semiconductor device is alsoformed to have an isotropic space on the sidewall of the drain regionand a conductive layer filled in the isotropic space to form a bit line.As the bit line is formed in the isotropic space of a drain region, itscontact area with the drain region can increase, which may improve(reduce) the drain contact resistance.

Embodiments of the present invention will now be further described withreference to the FIGS. 2 through 4J. FIG. 2 is a plan view of asemiconductor device with a photoresist pattern for defining a hard maskpattern formed on a hard mask layer according to some embodiments of thepresent invention. FIGS. 3A through 3J are perspective viewsillustrating a method of manufacturing a vertical channel semiconductordevice according to some embodiments of the present invention. FIGS. 4Athrough 4J are cross-sectional views further illustrating the method ofFIGS. 3A-3J. Specifically, portions “X1”, “X2” and “Y” in FIGS. 4Athrough 4J are sections taken along lines X1-X1′, X2-X2′ and Y-Y′ inFIG. 2, respectively.

Referring to FIGS. 2, 3A and 4A, a pad oxide layer 105 and a hard masklayer 108 are sequentially deposited on a semiconductor substrate 100.The pad oxide layer may be a silicon oxide layer formed by thermaloxidation, and may be formed to a thickness of about 50-150 Å. The hardmask layer 108 may be formed of a material having an etch selectivitywith respect to the semiconductor substrate 100 (e.g., a siliconsubstrate) and the pad oxide layer 105, and the material of the hardmask layer 108 may be a silicon oxide and/or a silicon nitride.

Photoresist patterns 112 for defining transistor regions may be formedon the hard mask layer 108 by photolithography. The photoresist pattern112 may have the shape of a square whose side has a length of 1 F (whereF is the minimum feature size). Also, the hard mask patterns 112neighboring in an X-axis direction may have a 0.5-F gap therebetween,and the hard mask patterns 112 neighboring in a Y-axis direction mayhave a 1.5-F gap therebetween. Using the photoresist pattern, the hardmask layer 108 may be etched to form a hard mask pattern 110. The hardmask pattern 110 may be used as a mask for defining a region in whichthe transistor will be formed. Although the photoresist pattern 112 isillustrated in the shape of a square in FIG. 2, the resulting etchedpattern 110 may have the shape of a cylinder, as illustrated in FIG. 3A,due to abrasion that may occur during the etching process.

Referring to FIGS. 3B and 4B, using the hard mask pattern 110 as an etchmask, the exposed semiconductor substrate 100 may be etched to arelatively small depth of, for example, about 100-300 Å.

Referring to FIGS. 3C and 4C, a first insulating layer 115 is shownformed on the surface of the exposed semiconductor substrate 100. Thefirst insulating layer 115 may be a silicon oxide layer, and may beformed by depositing an oxide layer on the resulting structure of thesemiconductor substrate 100 and/or by oxidizing the surface of thesemiconductor substrate 100. Thereafter, an anisotropic etch-backprocess is performed on the first insulating layer 115 to expose thesurface of the hard mask pattern 110 and the surface of thesemiconductor substrate 100, such that the first insulating layer 115remains on the sidewall of the semiconductor substrate 100 correspondingto the sidewall of the hard mask pattern 110.

Referring to FIGS. 3D and 4D, using the hard mask pattern 110 as an etchmask, the exposed semiconductor substrate 100 may be dry-etched to apredetermined depth of, for example, 800-1500 Å to form pillars 100 a.

Referring to FIGS. 3E and 4E, using the hard mask pattern 110 and thefirst mask layer 115 remaining on a portion of the sidewall of thepillar 100 a as an etch mask, the resulting structure of thesemiconductor substrate 100 may be isotropically etched to a depth ofabout 150-500 Å. Consequently, an isotropic space S1 is provided on thesidewall of the pillar 100 a. As the first insulating layer 115 remainson a portion of the sidewall of the pillar 100 a, the isotropic space S1is formed on the side wall region of the pillar 100 a spaced apart fromthe bottom surface of the pad oxide layer 105 by a predetermineddistance.

Referring to FIGS. 3F and 4F, a gate insulating layer 120 is formed onthe semiconductor substrate 100 including the isotropic space S1. Thegate insulating layer 120 may be formed by deposition and/or oxidation,and may be formed using a silicon oxide (SiO₂) layer, a hafnium oxide(HfO₂) layer, a tantalum oxide (Ta₂O₅) layer, an oxide/nitride (ON)layer, and/or an oxide/nitride/oxide (ONO) layer.

A gate electrode material, for example, an n-type impurity dopedpolysilicon layer, a p-type impurity doped polysilicon layer and/or asilicon germanium layer, is shown deposited on the resultant structureof the semiconductor substrate on which the gate insulating layer 120 isformed. For example, the gate electrode material may be formed to such athickness as to fill the isotropic space S1. Thereafter, the gateelectrode material is anisotropic etched-back to expose the hard maskpattern 110 and the gate insulating layer 120, thereby forming a gateelectrode 125 surrounding the pillar 100 a in the isotropic space S1 ofthe pillar 100 a. The gate electrode 125 is shown formed spaced apartfrom the upper surface of the pillar 100 a by the length of the firstinsulating layer 115.

Thereafter, junction region impurities, for example, phosphorus (31P)ions or arsenic (75 As) ions, may be implanted into the semiconductorsubstrate 100 covered with the gate insulating layer 120 between thehard mask patterns 110, thereby forming a drain region 130.

A second insulating layer is deposited on the resulting structure of thesemiconductor substrate 100. The second insulating layer may be formedto such a thickness as to fill a row (or line X1-X1′) directional gapbetween the mask patterns 110, and may be formed using a silicon oxidelayer. Thereafter, the second insulating layer may be anisotropicallyetched to form insulating spacers 135 on the sidewalls of the hard maskpatterns 110 and the gate electrodes 125. As illustrated in FIG. 4F, theinsulating spacer 135 fills a row directional gap between the pillars100 a, but does not fill a column (line Y-Y′) directional gap of thepillars 100 a to leave exposed a portion of the drain region 130.

A transition metal layer (not illustrated) may be formed on theresulting structure of the semiconductor substrate 100 to apredetermined thickness. The transition metal layer may be formed of amaterial that may be selected from the group consisting of titanium,tantalum, tungsten, nickel, and cobalt. Thereafter, the transition metallayer may be thermally processed to form a silicide layer 148 on theexposed portion of the semiconductor substrate 100, that is, on thedrain region 130.

Referring to FIGS. 3G and 4G, the semiconductor substrate 100, includingthe drain region 130 and the silicide layer 148, is etched using theinsulating spacer 135 as an etch mask. Consequently, the pillars 100 aarranged in the row direction may be isolated from one another. Also,during the isolation process, the silicide layer 148 may be etched toselectively define a bit line 150 in a predetermined portion of thedrain region 130. The bit line 150 may also be referred to as a “drain(or source) signal line”. Thereafter, channel stop impurity ions, forexample, BF₂ ions may be implanted into the semiconductor substrate 100so as to completely separate channels. The BF₂ ions may be implanted ata concentration of 5×10¹³/cm² to 10¹⁴/cm².

Referring to FIGS. 3H and 4H, a first interlayer insulating layer 155(e.g., a silicon oxide layer) is shown deposited on the resultingstructure of the semiconductor substrate 100 to a thickness of 4000-5000Å, and then the resulting structure is planarized to expose the surfaceof the hard mask pattern 110. Thereafter, a predetermined portion of thefirst interlayer insulating layer 155 is etched to define a region forforming word lines, which will be referred to herein as awordline-intended region. The wordline-intended region is a line grooveexposing the gate electrodes 125 of the pillars 100 a that are parallelin the column direction. The wordline-intended region may be formed tosuch a depth as to expose the gate electrode 125, for example, about1500-2000 Å, and may be formed substantially perpendicular to the bitline.

Thereafter, a wordline conductive layer (e.g., a doped polysiliconlayer, a transition metal layer and/or a transition metal silicidelayer) is deposited on the resulting structure of the semiconductorsubstrate 100 to fill the wordline-intended region. The wordlineconductive layer is planarized to expose the surface of the firstinterlayer insulating layer 155 and is then etched to a thickness of500-1000 Å such that it has the same height level as the gate electrode125, thereby forming a wordline 160. The wordline 160 may also bereferred to as a “gate signal line. The wordline 160 electricallycontacts with the gate electrode 125 and extends perpendicular to thebit line 150. A second interlayer insulating layer 165 is showndeposited to a thickness of about 100-1500 Å on the resulting structurewhere the wordline 160 is formed and then planarized to expose the hardmask pattern 110.

Referring to FIGS. 3I and 4I, the exposed hard mask pattern 110 isremoved. Thereafter, junction region impurities (e.g., phosphorus ionsand/or arsenic ions) are implanted into the exposed region of thesemiconductor substrate 100 (i.e., the surface of the pillar 100 a) toform a source region 170. The gate electrode 125 is formed spaced apartfrom the upper surface of the pillar 100 a, and the gate electrode 125and the pillar 100 a are insulated with the gate insulating layer 120therebetween. Therefore, the source region 170 can be formed on theentire surface of the pillar 100 a. And then, the pad oxide layer 105formed on the source region may be removed using well known method.

Next, a conductive layer (e.g., a doped polysilicon layer, a metal layerand/or a silicide layer) may be deposited to a thickness of 500-1000 Åon the second interlayer insulating layer 165 to contact with the sourceregion 170 and fill the space between the second interlayer insulatinglayers 165. Thereafter, the deposited conductive layer may be planarizedto form source contact pads 175. As the source contact pad 175 is formedin a region where the hard mask pattern 110 was formed and then removed,its contact area with the source region 170 can be increased. Inaddition, due to the first insulating layer 115, the gate electrode 125is disposed spaced apart from the surface of the semiconductor substrate100 by a predetermined distance. Therefore, the source contact pad 175can be formed in the entire region where the hard mask pattern wasformed, without interposing an insulating material (e.g., a spacer).

Referring to FIGS. 3J and 4J, a cylindrical storage electrode 180 isformed on the source contact pad 175. As shown in FIG. 4J, the gateelectrode 125 is formed around the periphery of the pillar 100 a at aposition spaced apart from the upper surface of the pillar 100 a.Accordingly, the entire upper surface of the pillar 100 a is provided asthe source region 170.

In addition, the gate electrode 125 is electrically insulated from thesource region 170 by the gate insulating layer 120 and the firstinsulating layer 115. Therefore, the contact pad 175 occupying theentire area of a source region 170 a can be formed without providing aspacer to insulate it from the gate electrode 125 on the source region170. As the contact pad 175 can contact with the entire source region170 a, the contact area therebetween can increase to improve (or reduce)the contact resistance.

Further embodiments will now be described with reference to FIGS. 2,5A-5D and 6A-6D. FIGS. 5A through 5D are perspective views illustratinga method of manufacturing a vertical channel semiconductor deviceaccording to further embodiments of the present invention. FIGS. 6Athrough 6D are cross-sectional views further illustrating theembodiments of FIGS. 5A through 5D. Specifically, portions “X1”, “X2”and “Y” in FIGS. 6A through 6D are cross-sections taken along linesX1-X1′, X2-X2′ and Y-Y′ in FIG. 2, respectively.

As described for the previous embodiments, a pad oxide layer 105 and ahard mask pattern 110 are sequentially formed on a semiconductorsubstrate 100, and then the semiconductor substrate 100 is etched in theshape of the hard mask pattern 110 to a thickness of 800-1500 Å to formpillars 100 a. Referring to FIGS. 5A and 6A, using the hard mask pattern110 as an etch mask, the pillars 100 a are anisotropically etched to awidth of about 200-300 Å to define a gate electrode intended region. Thesurfaces of the pillar 100 a and the semiconductor substrate 100 arethermally oxidized to form a gate insulating layer 120. A gate electrodeconductive layer is deposited on the resulting surface of thesemiconductor substrate 100 and is anisotropically etched to form a gateelectrode 126 around the pillar 100 a.

Thereafter, junction region impurities (e.g., phosphorus (31P) ions orarsenic (75As) ions) are implanted into the semiconductor substrate 100covered with the gate insulating layer 120 between the hard maskpatterns 110, thereby forming a drain region 132. The junction regionimpurities may be implanted to a relatively large penetration depth Rpof about 800-1200 Å. In some embodiments, the drain region 132 has anactual depth of about 1500-2000 Å.

Referring to FIGS. 5B and 6B, a second insulating layer is deposited onthe resulting structure of the semiconductor substrate 100 in which thedrain region 132 is formed. The second insulating layer may be depositedusing a silicon oxide layer. The second insulating layer may bedeposited to such as a thickness as to fill a row directional gapbetween the hard mask patterns 110. The second insulating layer isanisotropically etched to expose the hard mask pattern 110 and the gateinsulating layer 120, thereby forming insulating spacers 135 on thesidewalls of the hard mask pattern 110 and the gate electrode 125.

Referring to FIGS. 5C and 6C, using the insulating spacers 135 as anetch mask, the exposed drain region 132 is etched to a depth smallerthan the depth of the drain region 132, for example, 200-300 Å.Consequently, a predetermined portion of the sidewall of the drainregion 132 is exposed. A third insulating layer 140 is formed on theexposed surface of the semiconductor substrate 100, that is, the sideand bottom surfaces of the drain region 132. The third insulating layer140 may be a silicon oxide layer formed by oxidation or deposition, andmay be formed to a thickness of about 100-200 Å.

Referring to FIGS. 5D and 6D, using the insulating spacers 135 as anetch mask, the third insulating layer 140 and the semiconductorsubstrate 100 (i.e, drain region) are anisotropically etched to apredetermined thickness. The semiconductor substrate 100 may be etchedto a thickness of 1000-1500 Å so that the drain region 132 remaining mayhave a thickness of 100-500 Å. At this point, the third insulating layer140 is extended to a predetermined length on the upper sidewall of theexposed drain region 132.

Thereafter, using the insulating spacer 135 and the third insulatinglayer 140 as an etch mask, the sidewall of the exposed drain region 132is isotropically etched to a thickness of about 200-500 Å to form anisotropic space S2 in the drain region 132. The isotropic etchingprocess may be performed by wet etching.

A bit line conductive layer is deposited on the resulting structure ofthe semiconductor substrate 100 to fill the isotropic space S2. The bitline conductive layer may be formed using a transition metal layer(e.g., a titanium (Ti) layer, tantalum (Ta), a tungsten (W) layer,and/or a cobalt (Co) layer), a transition metal nitride layer (e.g., atitanium nitride (TiN) layer, a tantalum nitride (TaN) layer, and/or atungsten nitride (WN) layer), and/or a transition metal silicide layer(e.g., a titanium silicide (TiSi₂) layer, a tantalum silicide (TaSi₂)layer, a tungsten silicide (WSi₂) layer, and/or a cobalt silicide(CoSi₂) layer). The transition layer and the transition metal nitridelayer may be formed by deposition, and the transition metal silicidelayer may be formed by deposition or deposition/thermal reaction.

An anisotropic etch-back process is performed on the bit line conductivelayer to expose the surface of the hard mask pattern 110 and fill theisotropic space S2, thereby forming a bit line 152. At this point, asthe bit line 152 is formed in the isotropic space S2 by etching thedrain region 132 to a predetermined thickness, its contact area with thedrain region 132 may be increased, which may improve the contactresistance of the bit line 152. Also, the bit line 152 can be insulatedfrom the gate electrode 125 by the third insulating layer 140 formed inthe drain region 132.

Thereafter, using the insulating spacer 135 as an etch mask, the exposedsemiconductor substrate 100 is etched to a thickness of about 700-1500 Åto separate the drain regions 132, thereby isolating the pillars 100 aarranged in a column (or line Y-Y′) direction. Thereafter, for completechannel stop, impurity ions (e.g., BF₂ ions) may be selectivelyimplanted into the exposed semiconductor substrate 100.

Thereafter, as described above, a process of forming a wordline 160, aprocess of removing the hard mask pattern 110 to form a source region170, a process of forming a source contact pad 175 contacting with thesource region 170, and a process of forming a storage electrode may beperformed.

In the embodiments of FIGS. 5A-5D and 6A-6D, the sidewall of the drainregion 132 formed under the pillar 100 a is isotropically etched to forma predetermined space, and the bit line 152 is formed in thepredetermined space. Consequently, the contact area between the bit line152 and the drain region 132 can increase, which may improve the contactresistance.

FIGS. 7A through 7D are perspective views illustrating a method ofmanufacturing a vertical channel semiconductor device according to otherembodiments of the present invention. FIGS. 8A through 8D arecross-sectional views further illustrating the above manufacturingmethod. Specifically, portions “X1”, “X2” and “Y” in FIGS. 7A through 7Dare sections taken along lines X1-X1′, X2-X2′ and Y-Y′ in FIG. 2,respectively.

In substantially the same manner as described previously, the gateelectrode 125 may be formed around the pillar 100 a at a position spacedapart from the upper surface of the pillar 100 a by a predetermineddistance (See FIGS. 3A through 3F and 4A through 4F). Thereafter, asillustrated in FIGS. 7A and 8A, junction region impurities (e.g.,phosphorus (31P) ions or arsenic (75As) ions) are implanted into thesemiconductor substrate 100 covered with the gate insulating layer 120between the hard mask patterns 110 to form the drain region 132. Thejunction region impurities may be implanted to a penetration depth Rp ofabout 800-1200 Å. In some embodiments, the drain region 132 has anactual depth of about 1500-2000 Å.

Referring to FIGS. 7B and 8B, using the second insulating layer, aninsulating spacer 135 is formed on the sidewall of the hard mask pattern110. The insulating spacer 135 may be formed to such a thickness as tofill a row (line X1-X1′) direction gap between the hard mask patterns110, as described above.

Referring to FIGS. 7C and 8C, using the insulating spacer 135 as an etchmask, the substrate 100 including the exposed drain region 132 is etchedto a depth less than the depth of the drain region 132 (i.e., partiallyetching the drain region 132), for example, 200-300 Å. Consequently, thesidewall of the drain region 132 is exposed to a predetermined length.Thereafter, a third insulating layer 140 is formed on the exposedsurface of the drain region 132. The third insulating layer 140 may bean oxide layer formed by thermal oxidation and/or an insulating layerformed by deposition.

Thereafter, using the insulating spacers 135 as an etch mask, the thirdinsulating layer 140 and the semiconductor substrate 100 areanisotropically etched to a thickness of about 1000-1500 Å.Consequently, the third insulating layer 140 with a predeterminedthickness remains on the upper sidewall of the drain region 132.Thereafter, using the insulating spacer 135 and the third insulatinglayer 140 as an etch mask, the sidewall of the exposed drain region 132is isotropically etched to a thickness of about 200-500 Å to form asecond isotropic space S2 in the drain region 132. Thereafter, a bitline conductive layer is deposited on the resulting structure of thesemiconductor substrate 100 to fill the second isotropic space S2. Next,an anisotropic etch-back process is performed on the bit line conductivelayer to expose the surface of the hard mask pattern 110, therebyforming a bit line 152 in the second isotropic space S2. As the bit line152 is formed in the second isotropic space S2 of the drain region 132,its contact area with the drain region 132 increases, which may improvethe contact resistance of the bit line 152.

Thereafter, using the insulating spacer 135 as an etch mask, the exposedsemiconductor substrate 100 is etched to a depth of about 700-1500 Å toseparate the drain regions 132, thereby isolating the pillars 100 aarranged in a column (or line Y-Y′) direction. Thereafter, for improvedchannel stop characteristics, impurity ions (e.g., BF₂ ions) may beselectively implanted into the exposed semiconductor substrate 100.

Referring to FIGS. 7D and 8D, a first interlayer insulating layer 155,which is planarized to have the same height as the hard mask pattern110, is formed on the resulting structure of the semiconductor substrate100. Thereafter, a wordline intended region (not illustrated)perpendicular to the bit line 152 is formed to expose the gate electrode125 at the edge of the pillar 100 a.

A wordline conductive layer is filled into the wordline intended regionand is then etched to a predetermined thickness, such that it has athickness of about 500-1500 Å, thereby forming a wordline 160. Thewordline 160 electrically contacts the gate electrode 125 and extendsperpendicular to the bit line 152. A second interlayer insulating layer165 is deposited on the resulting structure of the semiconductorsubstrate 100 to a thickness of about 100-1500 Å, and is then planarizedto expose the hard mask pattern 110. The exposed hard mask pattern 110is removed along with the underlying pad oxide layer 105.

Junction region impurities (e.g., phosphorus ions or arsenic ions) areimplanted into the surface of the pillar 100 a to form the source region170. At this point, the source region 170 and the drain region 132 arelocated above and below the gate electrode 125 to form a channelperpendicular to the surface of the semiconductor substrate 100. Asource contact pad 175 is formed in the space between the secondinterlayer insulating layers 165 (i.e., the region from which the hardmask pattern 110 has been removed) to contact the source region 170. Asthe gate electrode 125 is formed around the periphery of the pillar 100a at a position spaced apart from the upper surface of the pillar 100 aby a predetermined distance, the entire upper surface of the pillar 100a is provided as the source region 170. In addition, the sidewall of thepillar 100 a above the gate electrode 125 serves as the source region170 and is covered with the insulating layer 115. Therefore, the contactpad 175 contacting the entire area of the source region 170 can beformed without providing a spacer for insulating it from the gateelectrode 125. Consequently, it may be possible to improve the contactresistance between the source region 170 and the source contact pad 175.A cylindrical storage electrode 180 is shown formed on the sourcecontact pad 175.

FIG. 9 is a perspective view of a vertical channel semiconductor deviceaccording to further embodiments of the present invention. FIG. 10 is across-sectional view of the vertical channel semiconductor device ofFIG. 9. Specifically, portions “X1”, “X2” and “Y” in FIG. 10 aresections taken along lines X1-X1′, X2-X2′ and Y-Y′ in FIG. 2,respectively.

Referring to FIGS. 9 and 10, the drain region 132 and the insulatingspacers 135 may be formed in the same manner as described previously.Thereafter, using the insulating spacers 135 as an etch mask, the drainregion 132 is anisotropically etched to a thickness of, for example,about 1000-1500 Å.

A bit line conductive layer is deposited on the resulting substrate 100,and an anisotropic etch-back process is performed on the bit lineconductive layer to form a space-shaped bit line 153 on the sidewall ofthe drain region 132. Using the bit line 153 as an etch mask, thesemiconductor substrate 100 is etched to isolate pillars 100 a.

Even when the spacer-shaped bit line 153 is formed on the sidewall ofthe drain region 132, the contact area between the spacer-shaped bitline 153 and the drain region 132 may increase and may improve (orreduce) the contact resistance.

In the above embodiments, the junction regions 130 and 132 formed belowthe gate electrodes 125 and 126 to contact with the bit line 150 havebeen referred to as the drain region, and the junction regions 170formed above the gate electrodes 125 and 126 to contact with the contactpad 175 have been referred to as the source region. However, it shouldbe noted that the junction region contacting the bit line 150 can be thesource region and the junction region contacting the contact pad 175 canbe the drain region.

Also, as a DRAM memory device has been illustrated for explanatorypurposes, a line for transmitting signals to the gate electrodes 125 and126 has been referred to as a wordline, and a line for transmittingsignals to the drain regions 130 and 132 has been referred to as a bitline. It will be apparent to those skilled in the art that the wordlineand the bit line may more generally be referred to as a gate signal lineand a source/drain signal line, respectively. In addition, although thestructure obtained by etching a predetermined portion of thesemiconductor substrate has been referred to as a pillar, it can also bereferred to as a protrusion or a silicon pattern.

Some embodiments of the present invention provide a vertical channelsemiconductor device that has an improved contact resistance and, thus,can provide improved electrical characteristics. Some embodimentsprovide a vertical channel semiconductor device that has an improved bitline contact resistance together with a sufficient source contact padarea and, thus, can provide an improved contact resistance. Method ofmanufacturing such vertical channel semiconductor devices are alsoprovided.

According to some embodiments, a gate electrode surrounding a pillar isformed spaced apart from the surface of the pillar by a predetermineddistance, and a second source/drain region is formed on the entiresurface of the pillar. Accordingly, the area of the second source/drainregion can be increased. Also, the contact pad contacting with thesecond source/drain region can be formed to such a size as to contactwith the entire surface of the source region, without the need of theinsulating spacer for insulating it from the gate electrode.Consequently, it may be possible to improve (or reduce) the contactresistance.

Also, in some embodiments, the isotropic space is provided on thesidewall of the drain region, and the bit line is formed in theisotropic space. Accordingly, the contact area between the firstsource/drain region and the bit line can be increased. Consequently, itmay be possible to improve the contact resistance.

While the present invention has been particularly shown and describedwith reference to exemplary embodiments thereof, it will be understoodby those of ordinary skill in the art that various changes in form anddetails may be made therein without departing from the spirit and scopeof the present invention as defined by the following claims.

1. A method of manufacturing a vertical channel semiconductor device,the method comprising: forming a pillar having a vertical depth on asemiconductor substrate; forming a gate electrode around a periphery ofthe pillar; forming a first source/drain region on the semiconductorsubstrate below the gate electrode; etching the first source/drainregion to a predetermined depth to expose a sidewall of the firstsource/drain region; forming an isotropic space on the sidewall of thefirst source/drain region vertically spaced apart from an upper surfaceof the first source/drain region by a predetermined distance; fillingthe isotropic space with a conductive layer to form a first source/drainsignal line; and forming a second source/drain region on an exposedupper surface of the pillar.
 2. The method of claim 1, wherein formingthe pillar comprises: forming a pad oxide layer and a hard mask patternon the semiconductor substrate; forming the pillar by etching the padoxide layer and the semiconductor substrate to a predetermined depth inthe shape of the hard mask pattern; and wherein forming the secondsource/drain region is preceded by: separating the first source/drainregion from adjacent source/drain regions; and removing the hard maskpattern.
 3. The method of claim 2, wherein forming the pillar comprises:etching the semiconductor substrate to a first depth using the hard maskpattern as an etch mask; selectively forming an insulating layer on thesidewall of the etched semiconductor substrate; and further etching thesemiconductor substrate to a second depth using the hard mask patternand the insulating layer as an etch mask.
 4. The method of claim 3,wherein forming the gate electrode comprises: isotropically etching thepillar using the hard mask pattern and the insulating layer as an etchmask to form an isotropic space; forming a gate insulating layer on thesurface of the pillar including the isotropic space; and filling theisotropic space with a conductive layer.
 5. The method of claim 2,wherein forming the gate electrode comprises: anisotropically etchingthe pillar to a predetermined width using the hard mask pattern as anetch mask; and covering the periphery of the pillar with a conductivelayer.
 6. The method of claim 2, further comprising forming a gatesignal line contacting the gate electrode after forming the firstsource/drain signal line and before removing the hard mask pattern. 7.The method of claim 6, wherein forming the gate signal line comprises:depositing a first interlayer insulating layer on the semiconductorsubstrate including the first source/drain signal line; etching apredetermined portion of the first interlayer insulating layer to form aline groove that is perpendicular to the first source/drain signal lineand exposes the gate electrode of the sidewall of the pillar; fillingthe line groove with an conductive layer contacting the gate electrode;etching back the conductive layer to a predetermined thickness; and thenfilling the line groove with a second interlayer insulating layer. 8.The method of claim 2, further comprising, after forming the secondsource/drain region: depositing a conductive layer on the secondinterlayer insulating layer to fill a space from which the hard maskpattern is removed; planarizing the conductive layer to form a contactpad; and forming a storage electrode on the contact pad.
 9. A method ofmanufacturing a vertical channel semiconductor device, the methodcomprising: forming a pad oxide layer and a hard mask pattern on asemiconductor substrate; forming pillars by etching the pad oxide layerand the semiconductor substrate to a predetermined depth in the shape ofthe hard mask pattern; forming a first isotropic space at a positionspaced apart from the upper surface of the pillar; forming a gateinsulating layer on the surface of the pillar including the firstisotropic space; filling the first isotropic space of the pillar with aconductive material to form a gate electrode disposed at a positionspaced apart from the upper surface of the pillar by a predetermineddistance to surround the pillar; forming a first source/drain region onthe semiconductor substrate below the gate electrode; etching the firstsource/drain region to a predetermined depth; forming a second isotropicspace on the sidewall of the first source/drain region spaced apart fromthe upper surface of the first source/drain region by a predetermineddistance; filling the second isotropic space with a conductive layer toform a first source/drain signal line; separating the first source/drainregion; forming a gate signal line contacting with the gate electrode;removing the hard mask pattern; and forming a contact pad contactingwith the second source/drain region.
 10. The method of claim 9, whereinthe forming of the pillar includes: etching the semiconductor substrateto a first depth using the hard mask pattern as an etch mask;selectively forming an insulating layer on the sidewall of the etchedsemiconductor substrate; and further etching the semiconductor substrateto a second depth using the hard mask pattern and the insulating layeras an etch mask.
 11. The method of claim 9, wherein the forming of thegate signal line includes: depositing a first interlayer insulatinglayer on the resulting structure of the semiconductor substrate on whichthe first source/drain signal line is formed; etching a predeterminedportion of the first interlayer insulating layer to form a line groovethat is perpendicular to the first source/drain signal line and exposesthe gate electrode of the pillar; filling the line groove with anconductive layer contacting with the gate electrode; etch-backing theconductive layer to a predetermined thickness; and filling the linegroove with a second interlayer insulating layer.
 12. The method ofclaim 11, wherein the forming of the contact pad includes: depositing aconductive layer on the second interlayer insulating layer to fill aspace from which the hard mask pattern is removed; and planarizing theconductive layer
 13. The method of claim 9, further comprising forming astorage electrode on the contact pad after the forming of the contactpad.